TK: I already know some of the answers, but since the ‘accident’ on Monday, i’ll repost my (long) questions just in case you or anyone else still has some new ideas or solutions. Or just in case someone else has a use for some answers given to my questions for his own project.
Thanks for the replies in the original post.
I’m about to finish the design of my MIOS based DB50XG project and i have some final questions.
1: How do use the RS232 interface together with the normal MIDI I/O, without losing the normal MIDI I/O functionality? Do i have to use 2 LTC modules, 1 LTC module and swap the IC’s when needed or by a different method?
2: How do i make a direct TTL connection between the CORE module and my own DB50XG module?
3: Which wirings/cabling can or can’t be bundled together? Is it only necessarry to separate the digital and analog wires?
4: What would be the maximum length of ALL the different wirings/cables? I already know the maximum length between 2 DIN modules shouldn’t be greater than 1 meter to avoid any problems.
5: What’s the difference between the SIL headers and ‘white headers’ on TK’s CORE module? And where can i get these? Is it only possible to buy them at stores like Farnell and Reichelt, because my local electronics shops don’t have other types of headers besides the SIL type.
6: Does anyone have a tested (and postitively approved ;D ) shematic for a headphones circuit which signal(s) have to be taken from the already existing line outputs?
If i do not want volume control for the headphones, just the output which is controlled by the main volume of the application (like on commercial synths/samplers etc by Roland/EMU/Yamaha etc), would that change the circuit very dramatic?
7: Which IC’s are recommended for opamp circuits? These will be used for the above application, the line outputs and the headphones circuit.
8: Does anyone have some clear info on Star-like wiring and for which wirings/cabling it is necesarry?
9: I can use 8 bankstick IC’s of 512 at the same time, right? Do these IC’s get a ‘number’ so MIOS understands which one is which? And how many times can data be written to and from these IC’s?
10: What would you think is best and what would you prefer? Putting ALL parameters that are in use (system and channel/part parameters) for 1 channel/part in 1 setup and switch between them (16 of them) by swapping from and to banksticks? Or only the channel/part dependent parameters in 1 setup and leave the ‘system’ parameters in the PIC’s RAM? Or maybe some different approach?
11: Has anyone tried to swap the 7805 for a PT5101N?
Someone told me this would solve all the heat problems that COULD occur when using a 7805.
Datasheet (PDF): PT5101 Datasheet
See also here
12: @TK: Why is a hardware reset (caused by the circuit attached to pin 26 of the DB50XG) necessarry for the DB50XG?
13: @TK: Could you take a look at this please? It’s about wrong pinnings descriptions for the waveblaster connector on/for the DB50XG. Can you confirm which pinning is correct, since you build an external unit yourself back in the days?
14: @TK: The name of my project will be TK50XGM… ;D