Some weeks ago Karl Dalen (KD) pointed out that bypass capacitors are missing in most modules. Using these caps for each IC device is a general design rule, they improve the power integrity. Although you possibly never noticed problems without these caps, there is no reason why they shouldn’t be added in the future.
Therefore I’ve updated following schematics. There are also snapshots which help to find the right places at the bottom of the PCBs - don’t try to place them exactly like me, just take care that one end of the cap has to be soldered as close to the +5V power input of the device as possible, and the other end to ground.
Core Module: two additional 100 nF ceramic caps:
http://www.ucapps.de/mbhp/mbhp_core.pdf
AINX4 Module: four additional 100 nF ceramic caps for the PIC:
(I’ve used a so called “shrink hose” (german: “Schrumpfschlauch”) to isolate the cap leg which goes to ground)
http://www.ucapps.de/mbhp/mbhp_ainx4.pdf
DINX4 Module: four additional 100 nF ceramic caps for the 74HC165:
http://www.ucapps.de/mbhp/mbhp_dinx4.pdf
DOUTX4 Module: four additional 100 nF ceramic caps for the 74HC595, one additional 100 uF elcap at the power input of the module:
http://www.ucapps.de/mbhp/mbhp_doutx4.pdf
LTC Module: two additional 100 nF ceramic caps for the 74HC00:
http://www.ucapps.de/mbhp/mbhp_ltc.pdf
SID Module: two additional 100 nF ceramic caps for the 74HC595:
http://www.ucapps.de/mbhp/mbhp_sid.pdf
SHX8 Module: nine additional 100 nF ceramic caps for the 74HC595 and NJU7304:
http://www.ucapps.de/mbhp/mbhp_shx8.pdf
(no picture)
Best Regards, Thorsten.





